All Latest Electronics NewsAccelerating AI in automotive applications
18/09/2019
Infineon and Synopsys are collaborating in the development of artificial intelligence solutions for safer, smart and more eco-friendly cars.
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CEVA unveils AI inference processor architecture for edge devices
18/09/2019
CEVA has announced the NeuPro-S, its second-generation AI processor architecture for deep neural network inferencing at the edge.
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Arrow Electronics introduces XoverIoT certified Sigfox modules
18/09/2019
Arrow Electronics is now shipping SIGFOX-MOD1-certified Sigfox modules created by XoverIoT. The modules are intended to help accelerate the development of Internet of Things solutions, leveraging consistent, low-energy Sigfox wireless connectivity.
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Qualcomm and Ericsson prepare next phase of 5G commercialisation
16/09/2019
Another milestone has been reached in the commercialisation of 5G with the news that Qualcomm and Ericsson have completed a 5G New Radio (NR) data connection that's compliant with global 3GPP 5G NR Release 15 specifications in Standalone (SA) mode of operation.
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Arm Flexible Access extended to include research
16/09/2019
Earlier this year, Arm announced the availability of Arm Flexible Access making it easier to access access and license Arm technology for semiconductor design.
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Report suggests strong growth for the RF power amplifier market
16/09/2019
A market report from Fact,MR suggests that the $3 billion RF power amplifier market is to experience compound annual growth of 12.2% through to 2028.
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NI unveils Semiconductor Test System (STS) software enhancements
13/09/2019
NI has released new STS software enhancements that are intended to deliver significant improvements to the programming and debugging experience, test execution speed, parallel test efficiency and overall equipment efficiency for the NI Semiconductor Test System.
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Imec and NUS to collaborate on chip-based quantum cryptography technology
13/09/2019
Imec, the research and innovation hub in nanoelectronics and digital technologies, and the National University of Singapore (NUS) have signed a research collaboration agreement to develop chip-based prototypes for secure quantum communication networks.
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Arrow Electronics launches European FPGA developer contest
13/09/2019
Arrow Electronics has launched a competition to find the most innovative and imaginative FPGA-based designs in Europe.
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Murata’s soil sensor increases crop yield and quality
12/09/2019
Aimed at the agricultural and horticultural industries, Murata has developed an accurate soil sensor that enables growers to increase the yield and quality of crops while cutting the costs associated with the use of water and fertilisers.
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Capacitors 3D printed on the DragonFly system from Nano Dimension
12/09/2019
Nano Dimension has developed 3D printed capacitors using the company’s pioneering DragonFly additive manufacturing system.
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Nexeon and WACKER renew strategic partnership
12/09/2019
Nexeon, the company developing and supplying battery materials for rechargeable Li-ion batteries, has extended its strategic partnership with the global chemicals company WACKER Chemie AG.
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C2A Security and NXP collaborate on cybersecurity solution
12/09/2019
C2A Security, a specialist in automotive cybersecurity, has announced a comprehensive automotive security solution, developed in collaboration with NXP that uses the company's secure CAN (Controller Area Network) transceivers.
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Graphene sets the stage for the next generation of THz astronomy detectors
11/09/2019
Researchers from the Chalmers University of Technology have been able to demonstrate a detector made from graphene that could revolutionise the sensors used in next-generation space telescopes
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IAR Systems updates RISC-V development tools
11/09/2019
IAR Systems, a supplier of software tools and services for embedded development, has announced a new version of the toolchain IAR Embedded Workbench for RISC-V.
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CEA-Leti and Orolia unveil FlexFusion, a new navigation technology
11/09/2019
Leti and Orolia, a specialist in terrestrial, aeronautic and naval transportation positioning, navigation and timing applications, have unveiled a new sensor-data-fusion engine.
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GSMA and 5GAA sign cooperation agreement
11/09/2019
The GSMA and the 5G Automotive Association (5GAA) have signed a three-year cooperation agreement in a move designed to accelerate the deployment of connected vehicles.
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Sir Hossein Yassaie joins Agile Analog
10/09/2019
Agile Analog has announced that Sir Hossein Yassaie, founder and CEO of Imagination, has become a non-exec at the Cambridge analogue EDA start-up.
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Insight SiP launches ISP1907-LL RF module
10/09/2019
Having extended its portfolio with the ISP4520 RF module, Insight SiP has launched the ISP1907-LL RF module, which has been designed for IoT applications which require Bluetooth 5.1 standard communication for Long Range and Direction-Finding connectivity.
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First single box, multi-channel solution for wideband mmWave measurements
10/09/2019
Keysight has announced the first single box multi-channel solution for wideband mmWave measurements in a move designed to speed up the development of next generation mmWave communications, satellite communications and radar applications.
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Teaching a chip to see
10/09/2019
When it comes to developing drugs to fight disease there aren’t enough model systems capable of identifying drug targets, screening for toxicity or predicting the efficacy of drug trials.
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Demand for electric vehicles surges in UK
10/09/2019
While UK car sales dropped by an annual 1.6% in August there was a 377.5% increase in registrations of battery electric vehicles, according to the car industry body, SMMT.
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SoC & ASIC designers gain from multiple HES Proto-AXI enhancements
10/09/2019
Aldec, a pioneer in mixed HDL language simulation and hardware-assisted verification for FPGA, ASIC and SoC designs, has enhanced its HES Proto-AXI software.
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DVCon Europe announces Keynotes for 2019
09/09/2019
The Design and Verification Conference & Exhibition Europe (DVCon Europe), to be held in Munich on October 29th and 30th and sponsored by the Accellera Systems Initiative, has announced two keynote speakers
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Ossia, E-PEAS & E Ink announce wireless collaboration
09/09/2019
Ossia, e-peas and E Ink have announced that they have successfully developed a wirelessly-powered Electronic Paper Display (“EPD”) prototype system that is entirely battery-free.
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